"Towards novel Mott FET: concept, present status and future"Who: Isao H. Inoue, AIST, Tsukuba, Japan Place: nanoGUNE seminar room, Tolosa Hiribidea 76, Donostia - San Sebastian Date: Thursday, 11 December 2014, 11:00 Host: Luis Hueso / Pablo Stoliar A
difficult but urgent challenge for condensed matter physicists is to develop
alternative electronics beyond the present Si ones, which are now confronted a
lethal problem called ?miniaturisation limit.? In 2020, a typical size of
transistors reaches 10 nm which contains only about 10 carriers. This will
decrease the switching energy smaller than the thermal noise limit (_100 kBT),
and ?on/off? states are no more distinguished. The saviour of our fully
electronics-depended society from the looming crisis ?fundamentally? is nothing
but to use Mott insulators. Mott insulator is a material in which all the carriers
are localised because of the strong electron correlations. Therefore, even in
such a nm-scale of Mott insulator, more than 100,000 ?localised? charges exist. They all are delocalized by
applying electric field. Then, huge amount of itinerant carriers are suddenly
created. Thus, the Mott FET is believed to have no worry of the miniaturisation
limit. However, the fabrication of Mott FET has come up against a severe
problem. Essentially, the Mott insulator behaves as an ionic crystal due to the
charge localisation, and ionic defects can form quite easily. Hence, the Mott transition
is not controlled straightforwardly by simply applying the gate electric field.
This renders the Mott FET unsuitable for integration to the present solid-state
electronics. To overcome the defects
problem, we have proposed an idea: inserting a thin organic insulator
Parylene-C between the Mott insulator and the high-k gate insulator [1, 2]
(Fig.1). Parylene-C is inert to any materials and does not damage the channel
interface when deposited. We have examined this idea by using SrTiO3
as a channel material. Although SrTiO3 is
not the Mott insulator, it is widely used as a substrate of preparing films of
Mott insulators. Our FET has demonstrated to accumulate carriers to the order
of 1014 cm?2 keepping
the field effect mobility as high as 10 cm2/Vs
even at room temperature. A brief history and background of the Mott FET
research is given in this talk, and possible plans for the future practical
Mott FET are also discussed.
References [1]
I. H. Inoue and Hisashi Shima, Japan Patent Number: 5522688, Date of Patent:
18th April, 2014. [2]
A. B. Eyvazov, I. H. Inoue, P. Stoliar, M. J. Rozenberg, C. Panagopoulos,
Scientific Reports 3, 1721 (2013).
Brief
Biography Isao
H. Inoue received BSc, MSc, and DSc degrees in Physics from the Univer- sity of
Tokyo in 1990, 1992 and 1998, respectively. He became a tenure researcher of
the Electrotechnical Laboratory (ETL) in 1992 and a senior researcher in 1999. From 1999 to 2001, he was a visiting scholar
at Cavendish Laboratory, University of Cambridge. In 2001, ETL was re-organized
to the National Institute of Advanced Industrial Science and Technology (AIST);
since then, he has been a senior researcher of AIST. He studied in a wide range
of research field: from the high-energy spectroscopies and fermiology of
strongly correlated materials to the development of the Mott transistor, ReRAM,
and other electronic devices, which utilise functional oxides, where electron
correlations play a crucial role. |